WARNING:
engineering defect in stock Intel heatsink/fan units
for LGA-775 socket CPUs
(This generic message only applies to
Intel CPUs with LGA-775 socket and
stock Intel heatsink/fan units.)
The problems with high CPU temperatures
are most probably the result of improper seating
of the stock Intel heatsink/fan unit ("HSF").
That heatsink and fan do dissipate heat quite
adequately, as long as the HSF maintains
enough downward pressure on the top of
the CPU chip.
However ...
the 4 pronged fasteners (“push pins”) are not gripping properly,
and this results in less downward pressure on the
top of the CPU chip: less downward
pressure
translates directly into higher CPU temps.
Also, the push pins are made of a material
that appears to be "creeping" after many cycles
of heat and cold, which further reduces the
downward pressure on the top of the CPU chip.
A short-term solution is to unlock and re-lock each
push pin, while pressing down with your thumb on
the fan housing directly above each push pin.
Doing this one thing reduced our CPU temp from
140 F. to 100 F., which helped isolate the problem.
Best solution is to switch to a superior HSF
with a proper backing plate. We prefer the
ASUS VR Guard Series, because of its
superior
engineering for cooling the voltage regulators
on recent high-end ASUS LGA-775 motherboards.
[And, since this WARNING was first written,
a number of superior HSFs have become available
which incorporate proper backing plates and also
machine screw fasteners with integrated springs.]
Here is a link to a company which sells a product
called LGA775
Bolt-Thru-Kit with Screws & Springs:
http://www.sidewindercomputers.com/lgbowiscsp.html
These photos show evidence of improper seating
on a recent ASUS motherboard with stock Intel HSF:
http://www.supremelaw.org/systems/heatsinks/
http://www.supremelaw.org/systems/heatsinks/Intel%20Stock.2.jpg
The chrome foot inside the red circle on the left
is raised up about 1mm higher than the chrome foot
inside the red
circle on the right.
Also, Intel's Thermal Interface Material ("TIM")
is too thick from the factory, which also results
in improper seating i.e. all 4 push pins
do not "lock" properly, even when applying a
lot of downward pressure on each one.
This TIM should be removed and replaced with
a razor-thin layer of Arctic Silver (or comparable
thermal paste) -- NO OOZING PLEASE!!
I hope this helps.
p.s. If you
purchased your computer from a company
that uses Return Merchandise Authorizations
("RMA"),
you should start a new RMA so that this defect and
solution
are reported formally to your supplier.
Sincerely yours,
/s/ Paul Andrew Mitchell
Webmaster, Supreme Law Library
http://www.supremelaw.org/
p.s. Documentation of prior efforts to isolate
this problem
are documented here: